Intel's goal is to be the first to create the first computer to compute at Exaflops. Therefore, Intel is improving its processor architecture, hoping to achieve this goal between 2018 and 2020. Intel is integrating network and storage controllers into its processors. In this way, the supercomputer can provide faster results. This integration will speed up the communications link between the processor and the network and storage systems and create a way to make Exaflop computers. This kind of computer is about 50 times faster than the fastest computer at present. Joe Yaworski, structural product marketing manager at Intel, said that we did not have much difficulty in achieving that goal. In this process, if we solve every problem, the entire supercomputer and cloud market will benefit. With current chips and components, Exaflop computers can be very expensive, bulky and very power hungry. Intel is developing fabric technology to bring data communications closer to the processor, improving bandwidth and reducing the number of components in the supercomputer. Fabric virtualization I / O (bundling in / out) and bundling data center storage with networking and the integrated controller will provide a wider channel with reduced latency. Companies such as Google, Facebook and Amazon are heavily buying servers and are considering reducing their energy costs while improving system performance. Depending on the system's topology, the fabric intelligently moves data between processors, servers, memory, storage, and devices. By reorganizing data communications, data can be moved in an energy-efficient manner. High-performance computers have a proprietary interconnect architecture based on Infiniband, Ethernet, and Aries like Cray. At the same time, microprocessors have Ethernet-based and PCI-Express-based architectures. Advanced Micro Devices in its SeaMicro Cloud Servers provide the Freedom Fabric to support standard networked storage products. Yaworski said that in addition to improving bandwidth, integrated architecture controllers will reduce power consumption and computer density. He said the structure is beginning to be the next bottleneck. To solve these bottlenecks, you need to push this structure closer to the processor. In the future, Intel will combine the technical expertise of multiple internal departments to provide an integrated architecture product in the near future. Dean McCarron, principal analyst at market research firm Mercury Research, said virtually every type of network technology such as Ethernet or Infiniband is suitable for supercomputer clusters. External components make localized network connections. The integrated controller can reduce the number of components on the motherboard. It can also create components used by large clusters. Such components need to establish fewer connections. Intel has been providing network components for many years. However, Intel's struggling business attracted attention after acquiring Ethernet specialist Fulcrum Microsystems and the acquisition of Qlogic's unlimited bandwidth assets at the beginning of last year, and the acquisition of Cray's supercomputer interconnect assets in April last year. These acquisitions provide Intel with a wide range of products critical to supercomputers, including processors, networking technologies, networking and storage. Intel has supplied the Xeon Phi coprocessor for supercomputers. This coprocessor has 60 cores and works with the Xeon server processor. Intel initially focused on integrating Infiniband. Infiniband is a high-speed connectivity technology used in supercomputers to replace Ethernet and Fiber Channel. Intel recently updated its True Switch product line. This is the first update of a product acquired from Qlogic. The new True Switch product line brings the controller closer to the processor while improving performance through software-based fabric management and providing more communication channels through an additional card. This new product can be expanded to 10,000 ports and even extended to more ports with dedicated hardware. This improvement can help speed up the implementation of computational fluid dynamics and other tasks. This task is the key to designing the aircraft. True Switch is designed for the Xeon E5-2600 processor line, code-named "Romley." This processor is based on the Sandy Bridge microarchitecture. True Switch products include a dedicated chip that connects the host and fabric and also includes network devices such as adapters, switches, software, and cables. Intel also has the added advantage of developing and manufacturing its products. This will help Intel achieve effective integration at the processor level.
Die-casting molds are a method of casting liquid forging, a process performed on a dedicated die-casting forging machine. Its basic technological process is: Molten metal is first filled into the mold cavity at a low speed or high speed. The mold has a movable cavity surface. It pressurizes forging with the cooling process of the molten metal, which eliminates shrinkage shrinkage of the blank. Loose defects also make the internal structure of the blank reach the forged broken grains. The overall mechanical properties of the blank have been significantly improved.
Designing Process
1. according to the product used in the type of materials, product shape and accuracy of the indicators such as the process analysis, set out the process. Aluminum Die Casting Mould,Motorcycle Cylinder Head Aluminum Die Casting Mould,Reducer Motor Housing Aluminum Die Casting Mould,Die Casting Mold Zheke Mould Technology Co. Ltd. , https://www.zkdiecasting.com
2. Determine the position of the product placed in the mold cavity, analyze and design the parting surface, overflow system, and pouring system.
3. Design core assembly and fixing methods for each activity.
4. pull core distance and force design.
5. the design of the ejection mechanism.
6. determine the die casting machine, the mold frame and cooling system design.
7. Check the relative dimensions of the die and the die casting machine, draw the die and the artwork of each component.
8. the design is completed.